GS816272C-166 vs CXK79M72C164GB-28 feature comparison

GS816272C-166 GSI Technology

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CXK79M72C164GB-28 Sony Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GSI TECHNOLOGY SONY CORP
Part Package Code BGA BGA
Package Description LBGA, BGA, BGA209,11X19,40
Pin Count 209 209
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 7 ns 1.7 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY PIPELINED ARCHITECTURE; LATE WRITE
JESD-30 Code R-PBGA-B209 R-PBGA-B209
Length 22 mm 22 mm
Memory Density 18874368 bit 18874368 bit
Memory IC Type CACHE SRAM STANDARD SRAM
Memory Width 72 72
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 209 209
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX72 256KX72
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 220
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 2.3 mm
Supply Voltage-Max (Vsup) 2.7 V 1.95 V
Supply Voltage-Min (Vsup) 2.3 V 1.7 V
Supply Voltage-Nom (Vsup) 2.5 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 1
Pbfree Code No
Clock Frequency-Max (fCLK) 350 MHz
I/O Type COMMON
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code BGA209,11X19,40
Standby Current-Max 0.325 A
Standby Voltage-Min 1.7 V
Supply Current-Max 0.88 mA
Terminal Finish TIN LEAD

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