CXK79M72C164GB-28 vs GS8171DW72AGC-350 feature comparison

CXK79M72C164GB-28 Sony Semiconductor

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GS8171DW72AGC-350 GSI Technology

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SONY CORP GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description BGA, BGA209,11X19,40 14 X 22 MM, 1 MM PITCH, LEAD FREE, BGA-209
Pin Count 209 209
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A991.B.2.B
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 1.7 ns 1.7 ns
Additional Feature PIPELINED ARCHITECTURE; LATE WRITE PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 350 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B209 R-PBGA-B209
JESD-609 Code e0 e1
Length 22 mm 22 mm
Memory Density 18874368 bit 18874368 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 72 72
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 209 209
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX72 256KX72
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA209,11X19,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.3 mm 1.7 mm
Standby Current-Max 0.325 A
Standby Voltage-Min 1.7 V
Supply Current-Max 0.88 mA
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 1
Peak Reflow Temperature (Cel) 260

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