GS8161E36DGT-333V vs R1Q3A3618ABG-60R feature comparison

GS8161E36DGT-333V GSI Technology

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R1Q3A3618ABG-60R Renesas Electronics Corporation

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Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer GSI TECHNOLOGY RENESAS TECHNOLOGY CORP
Part Package Code QFP BGA
Package Description QFP, 15 X 17 MM, 1 MM PITCH, PLASTIC, LBGA-165
Pin Count 100 165
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.B 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 24 Weeks
Samacsys Manufacturer GSI TECHNOLOGY
Access Time-Max 5 ns
Additional Feature FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 2.5V
JESD-30 Code R-PQFP-G100 R-PBGA-B165
Memory Density 18874368 bit 37748736 bit
Memory IC Type CACHE SRAM QDR SRAM
Memory Width 36 18
Number of Functions 1 1
Number of Terminals 100 165
Number of Words 524288 words 2097152 words
Number of Words Code 512000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX36 2MX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage-Max (Vsup) 2 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING BALL
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 1 1
JESD-609 Code e1
Length 17 mm
Qualification Status Not Qualified
Seated Height-Max 1.46 mm
Terminal Finish TIN SILVER COPPER
Terminal Pitch 1 mm
Width 15 mm

Compare GS8161E36DGT-333V with alternatives

Compare R1Q3A3618ABG-60R with alternatives