GS8161E32DD-250
vs
MT58V512V32DF-10
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
GSI TECHNOLOGY
MICRON TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
LBGA,
13 X 15 MM, FBGA-165
Pin Count
165
165
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.B.2.B
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
5.5 ns
5 ns
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY
PIPELINED ARCHITECTURE
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
JESD-609 Code
e0
e0
Length
15 mm
15 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
CACHE SRAM
CACHE SRAM
Memory Width
32
32
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
512KX32
512KX32
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
TBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.2 mm
Supply Voltage-Max (Vsup)
2.7 V
2.625 V
Supply Voltage-Min (Vsup)
2.3 V
2.375 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
13 mm
13 mm
Base Number Matches
1
2
Clock Frequency-Max (fCLK)
100 MHz
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
BGA165,11X15,40
Standby Current-Max
0.03 A
Standby Voltage-Min
2.38 V
Supply Current-Max
0.21 mA
Compare GS8161E32DD-250 with alternatives
Compare MT58V512V32DF-10 with alternatives