GS8161E32DD-250
vs
GS8161E32DGD-200IV
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
GSI TECHNOLOGY
GSI TECHNOLOGY
Part Package Code
BGA
BGA
Package Description
LBGA,
LBGA,
Pin Count
165
165
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.B
3A991.B.2.B
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
5.5 ns
6.5 ns
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY
FLOW THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 2.5V
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
JESD-609 Code
e0
e1
Length
15 mm
15 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
CACHE SRAM
CACHE SRAM
Memory Width
32
32
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
512KX32
512KX32
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Qualification Status
Not Qualified
Seated Height-Max
1.4 mm
1.4 mm
Supply Voltage-Max (Vsup)
2.7 V
2 V
Supply Voltage-Min (Vsup)
2.3 V
1.7 V
Supply Voltage-Nom (Vsup)
2.5 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
13 mm
13 mm
Base Number Matches
1
1
Factory Lead Time
24 Weeks
Moisture Sensitivity Level
3
Compare GS8161E32DD-250 with alternatives
Compare GS8161E32DGD-200IV with alternatives