GS81302Q20AGD-450I vs GS81302DT20AGD-450IT feature comparison

GS81302Q20AGD-450I GSI Technology

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GS81302DT20AGD-450IT GSI Technology

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Part Life Cycle Code Active Active
Ihs Manufacturer GSI TECHNOLOGY GSI TECHNOLOGY
Package Description LBGA, BGA165,11X15,40 LBGA,
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.B 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 24 Weeks
Date Of Intro 2017-08-29
Access Time-Max 0.45 ns 0.45 ns
Additional Feature PIPE LINED ARCHITECTURE
Clock Frequency-Max (fCLK) 450 MHz
I/O Type SEPARATE
JESD-30 Code R-PBGA-B165 R-PBGA-B165
Length 15 mm 15 mm
Memory Density 150994944 bit 150994944 bit
Memory IC Type QDR SRAM QDR SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Ports 1
Number of Terminals 165 165
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Organization 8MX18 8MX18
Output Enable NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Reverse Pinout NO
Seated Height-Max 1.4 mm 1.4 mm
Standby Voltage-Min 1.7 V
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 13 mm
Base Number Matches 2 1
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Temperature Grade INDUSTRIAL

Compare GS81302Q20AGD-450I with alternatives

Compare GS81302DT20AGD-450IT with alternatives