GP30B-BP
vs
RGP30BZ
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Contact Manufacturer
Ihs Manufacturer
MICRO COMMERCIAL COMPONENTS CORP
GALAXY SEMI-CONDUCTOR CO LTD
Part Package Code
DO-201AD
Package Description
PLASTIC PACKAGE-2
O-PALF-W2
Pin Count
2
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.80
8541.10.00.80
Additional Feature
METALLURGICALLY BONDED
Application
GENERAL PURPOSE
FAST RECOVERY
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
JEDEC-95 Code
DO-201AD
DO-27
JESD-30 Code
O-PALF-W2
O-PALF-W2
JESD-609 Code
e3
Moisture Sensitivity Level
1
Non-rep Pk Forward Current-Max
125 A
125 A
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Output Current-Max
3 A
3 A
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Rep Pk Reverse Voltage-Max
100 V
100 V
Surface Mount
NO
NO
Terminal Finish
MATTE TIN
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Time@Peak Reflow Temperature-Max (s)
10
Base Number Matches
1
2
Forward Voltage-Max (VF)
1.3 V
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Reverse Current-Max
5 µA
Reverse Recovery Time-Max
0.15 µs
Compare GP30B-BP with alternatives
Compare RGP30BZ with alternatives