GM23C4100A-12 vs HN62435P-12 feature comparison

GM23C4100A-12 LG Semicon Co Ltd

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HN62435P-12 Hitachi Ltd

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LG SEMICON CO LTD HITACHI LTD
Reach Compliance Code unknown unknown
Access Time-Max 120 ns 120 ns
Alternate Memory Width 16 8
JESD-30 Code R-PDIP-T40 R-PDIP-T40
JESD-609 Code e0 e0
Memory Density 4194304 bit 4194304 bit
Memory IC Type MASK ROM MASK ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 40 40
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX8 512KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP40,.6 DIP40,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.00005 A 0.00003 A
Supply Current-Max 0.05 mA 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Part Package Code DIP
Package Description DIP, DIP40,.6
Pin Count 40
ECCN Code EAR99
HTS Code 8542.32.00.71
Additional Feature USER CONFIGURABLE AS 256K X 16; TTL COMPATIBLE I/O
Length 52.8 mm
Seated Height-Max 5.06 mm
Width 15.24 mm

Compare GM23C4100A-12 with alternatives

Compare HN62435P-12 with alternatives