GE28F640C3BC100
vs
M28W640ECT10ZB1F
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEL CORP
STMICROELECTRONICS
Part Package Code
BGA
BGA
Package Description
CSP, VFBGA-48
6.39 X 10.50 MM, 0.75 MM PITCH, LEAD FREE, TFBGA-48
Pin Count
48
48
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
100 ns
100 ns
Additional Feature
BOTTOM BOOT BLOCK
TOP BOOT BLOCK
Boot Block
BOTTOM
TOP
Command User Interface
YES
Common Flash Interface
YES
Data Polling
NO
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
JESD-609 Code
e0
e1
Length
9 mm
10.5 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Sectors/Size
8,127
Number of Terminals
48
48
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
4MX16
4MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
TFBGA
Package Equivalence Code
BGA48,6X8,30
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1.2 mm
Sector Size
4K,32K
Standby Current-Max
0.000005 A
Supply Current-Max
0.055 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
0.75 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
NO
Type
NOR TYPE
NOR TYPE
Width
7.7 mm
6.39 mm
Base Number Matches
2
2
Compare GE28F640C3BC100 with alternatives
Compare M28W640ECT10ZB1F with alternatives