GD74LS298J
vs
TC74HC298AP
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
GOLDSTAR ELECTRON CO LTD
|
TOSHIBA CORP
|
| Reach Compliance Code |
unknown
|
unknown
|
| JESD-30 Code |
R-CDIP-T16
|
R-PDIP-T16
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Number of Terminals |
16
|
16
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
| Part Package Code |
|
DIP
|
| Package Description |
|
DIP, DIP16,.3
|
| Pin Count |
|
16
|
| HTS Code |
|
8542.39.00.01
|
| Additional Feature |
|
FOUR 2:1 MUX FOLLOWED BY REGISTER
|
| Family |
|
HC/UH
|
| JESD-609 Code |
|
e0
|
| Length |
|
19.25 mm
|
| Load Capacitance (CL) |
|
50 pF
|
| Max I(ol) |
|
0.0052 A
|
| Number of Functions |
|
1
|
| Number of Inputs |
|
2
|
| Number of Outputs |
|
1
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Polarity |
|
TRUE
|
| Package Equivalence Code |
|
DIP16,.3
|
| Prop. Delay@Nom-Sup |
|
31 ns
|
| Propagation Delay (tpd) |
|
155 ns
|
| Seated Height-Max |
|
4.45 mm
|
| Supply Voltage-Max (Vsup) |
|
6 V
|
| Supply Voltage-Min (Vsup) |
|
2 V
|
| Supply Voltage-Nom (Vsup) |
|
4.5 V
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Pitch |
|
2.54 mm
|
| Width |
|
7.62 mm
|
|
|
|
Compare GD74LS298J with alternatives
Compare TC74HC298AP with alternatives