GD74HCT85D vs 74HCT85DB,112 feature comparison

GD74HCT85D LG Semicon Co Ltd

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74HCT85DB,112 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer LG SEMICON CO LTD NXP SEMICONDUCTORS
Package Description SOP, SOP16,.25 PLASTIC, SSOP-16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e0 e4
Logic IC Type MAGNITUDE COMPARATOR MAGNITUDE COMPARATOR
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SSOP
Package Equivalence Code SOP16,.25 SSOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Base Number Matches 2 2
Part Package Code SSOP1
Pin Count 16
Manufacturer Package Code SOT338-1
Factory Lead Time 4 Weeks
Additional Feature CASCADABLE
Family HCT
Length 6.2 mm
Load Capacitance (CL) 50 pF
Moisture Sensitivity Level 1
Number of Bits 4
Number of Functions 1
Output Polarity TRUE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 66 ns
Seated Height-Max 2 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Time@Peak Reflow Temperature-Max (s) 30
Width 5.3 mm

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