GD74HCT74J
vs
74HCT74N,652
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
GOLDSTAR ELECTRON CO LTD
NXP SEMICONDUCTORS
Package Description
,
0.300 INCH, PLASTIC, MO-001, SOT-27-1, DIP-14
Reach Compliance Code
unknown
compliant
Family
HCT
HCT
JESD-30 Code
R-CDIP-T14
R-PDIP-T14
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
1
1
Number of Functions
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
44 ns
53 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
fmax-Min
22 MHz
18 MHz
Base Number Matches
2
1
Rohs Code
Part Package Code
DIP
Pin Count
14
Manufacturer Package Code
SOT27-1
HTS Code
8542.39.00.01
Factory Lead Time
4 Weeks
Samacsys Manufacturer
NXP
JESD-609 Code
e4
Length
19.025 mm
Max Frequency@Nom-Sup
18000000 Hz
Max I(ol)
0.004 A
Package Equivalence Code
DIP14,.3
Packing Method
TUBE
Seated Height-Max
4.2 mm
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare GD74HCT74J with alternatives
Compare 74HCT74N,652 with alternatives