GD74HCT74J vs MM74HCT74N feature comparison

GD74HCT74J LG Semicon Co Ltd

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MM74HCT74N Rochester Electronics LLC

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LG SEMICON CO LTD ROCHESTER ELECTRONICS LLC
Package Description DIP, DIP14,.3 0.300 INCH, LEAD FREE, PLASTIC, MS-001, DIP-14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-XDIP-T14 R-PDIP-T14
JESD-609 Code e0 e3
Load Capacitance (CL) 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 22000000 Hz
Max I(ol) 0.004 A
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Base Number Matches 2 5
Pbfree Code Yes
Part Package Code DIP
Pin Count 14
Family HCT
Length 19.18 mm
Number of Bits 1
Output Polarity COMPLEMENTARY
Propagation Delay (tpd) 44 ns
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Width 7.62 mm
fmax-Min 21 MHz

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