GD74HCT175J
vs
5962-8970101EX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LG SEMICON CO LTD
INTERSIL CORP
Package Description
DIP, DIP16,.3
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-XDIP-T16
R-GDIP-T16
JESD-609 Code
e0
e0
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Max Frequency@Nom-Sup
22000000 Hz
16000000 Hz
Max I(ol)
0.004 A
0.004 A
Number of Functions
4
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
CERAMIC
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Base Number Matches
2
3
Part Package Code
DIP
Pin Count
16
Family
HCT
Length
19.56 mm
Number of Bits
4
Output Polarity
COMPLEMENTARY
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
50 ns
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
fmax-Min
16 MHz
Compare 5962-8970101EX with alternatives