5962-8970101EX
vs
CD54HCT175F/3
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTERSIL CORP
HARRIS SEMICONDUCTOR
Part Package Code
DIP
Package Description
DIP, DIP16,.3
,
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HCT
HCT
JESD-30 Code
R-GDIP-T16
R-CDIP-T16
JESD-609 Code
e0
Length
19.56 mm
Load Capacitance (CL)
50 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Max Frequency@Nom-Sup
16000000 Hz
Max I(ol)
0.004 A
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
50 ns
50 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
7.62 mm
fmax-Min
16 MHz
25 MHz
Base Number Matches
3
3
Compare 5962-8970101EX with alternatives
Compare CD54HCT175F/3 with alternatives