GD54HCT175D vs 74HCT175PW feature comparison

GD54HCT175D Goldstar Electron Co Ltd

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74HCT175PW NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer GOLDSTAR ELECTRON CO LTD NXP SEMICONDUCTORS
Package Description , TSSOP, TSSOP16,.25
Reach Compliance Code unknown compliant
Family HCT HCT
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 4 4
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 54 ns 50 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 18 MHz 17 MHz
Base Number Matches 1 2
Pbfree Code Yes
Rohs Code Yes
Part Package Code TSSOP
Pin Count 16
HTS Code 8542.39.00.01
JESD-609 Code e4
Length 5 mm
Max Frequency@Nom-Sup 20000000 Hz
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP16,.25
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.1 mm
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch 0.65 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm

Compare GD54HCT175D with alternatives

Compare 74HCT175PW with alternatives