GCIXP1200EB
vs
GCIXP1200GC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEL CORP
INTEL CORP
Part Package Code
BGA
BGA
Package Description
LBGA, BGA432,31X31,50
PLASTIC, BGA-432
Pin Count
432
432
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
200 MHz
232 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B432
S-PBGA-B432
Length
40 mm
40 mm
Low Power Mode
NO
NO
Moisture Sensitivity Level
1
Number of Terminals
432
432
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA432,31X31,50
BGA432,31X31,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.67 mm
1.67 mm
Speed
200 MHz
232 MHz
Supply Voltage-Max
2.1 V
2.1 V
Supply Voltage-Min
1.9 V
1.9 V
Supply Voltage-Nom
2 V
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
40 mm
40 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Factory Lead Time
4 Weeks
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare GCIXP1200EB with alternatives
Compare GCIXP1200GC with alternatives