GBPC5010-BP
vs
KBPC5010FP
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICRO COMMERCIAL COMPONENTS CORP
|
DIOTEC SEMICONDUCTOR AG
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Breakdown Voltage-Min |
1000 V
|
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
BRIDGE, 4 ELEMENTS
|
BRIDGE, 4 ELEMENTS
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
BRIDGE RECTIFIER DIODE
|
BRIDGE RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1.1 V
|
1.1 V
|
| JESD-30 Code |
S-PUFM-D4
|
S-PUFM-X4
|
| JESD-609 Code |
e3
|
e3
|
| Moisture Sensitivity Level |
1
|
1
|
| Non-rep Pk Forward Current-Max |
500 A
|
450 A
|
| Number of Elements |
4
|
4
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
4
|
4
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
-50 °C
|
| Output Current-Max |
50 A
|
50 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Reference Standard |
UL RECOGNIZED
|
UL RECOGNIZED
|
| Rep Pk Reverse Voltage-Max |
1000 V
|
1000 V
|
| Reverse Current-Max |
5 µA
|
10 µA
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
| Terminal Form |
SOLDER LUG
|
UNSPECIFIED
|
| Terminal Position |
UPPER
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
|
| Base Number Matches |
2
|
1
|
| Package Description |
|
28.60 X 28.60 MM, 7.30 MM HEIGHT, ROHS COMPLIANT, PLASTIC PACKAGE-4
|
| Pin Count |
|
4
|
| Samacsys Manufacturer |
|
Diotec
|
| Additional Feature |
|
UL RECOGNIZED
|
| Qualification Status |
|
Not Qualified
|
| Reverse Recovery Time-Max |
|
1.5 µs
|
| Reverse Test Voltage |
|
1000 V
|
|
|
|
Compare GBPC5010-BP with alternatives
Compare KBPC5010FP with alternatives