GBPC2510-S vs SB2510GM feature comparison

GBPC2510-S Formosa Microsemi Co Ltd

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SB2510GM Taiwan Semiconductor

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Rohs Code Yes Yes
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer FORMOSA MICROSEMI CO LTD TAIWAN SEMICONDUCTOR CO LTD
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.80
Breakdown Voltage-Min 1000 V 1000 V
Configuration BRIDGE, 4 ELEMENTS BRIDGE, 4 ELEMENTS
Diode Element Material SILICON
Diode Type BRIDGE RECTIFIER DIODE BRIDGE RECTIFIER DIODE
Forward Voltage-Max (VF) 1.1 V 1.1 V
JESD-30 Code R-PSFM-T4
Non-rep Pk Forward Current-Max 300 A 300 A
Number of Elements 4 4
Number of Phases 1 1
Number of Terminals 4
Operating Temperature-Max 150 °C 150 °C
Output Current-Max 25 A 25 A
Package Body Material PLASTIC/EPOXY
Package Shape SQUARE
Package Style FLANGE MOUNT
Rep Pk Reverse Voltage-Max 1000 V 1000 V
Surface Mount NO NO
Terminal Form THROUGH-HOLE
Terminal Position SINGLE
Base Number Matches 1 1
Case Connection ISOLATED
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260

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