GBPC2506 vs DB2501 feature comparison

GBPC2506 Sangdest Microelectronics (Nanjing) Co Ltd

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DB2501 Diotec Electronics Corp

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Rohs Code Yes Yes
Part Life Cycle Code Active Contact Manufacturer
Ihs Manufacturer SANGDEST MICROELECTRONICS (NANJING) CO LTD DIOTEC ELECTRONICS CORP
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.80 8541.10.00.80
Breakdown Voltage-Min 600 V 100 V
Configuration BRIDGE, 4 ELEMENTS BRIDGE, 4 ELEMENTS
Diode Element Material SILICON SILICON
Diode Type BRIDGE RECTIFIER DIODE BRIDGE RECTIFIER DIODE
Forward Voltage-Max (VF) 1.1 V 1.1 V
JESD-30 Code S-PUFM-D4 S-PUFM-D4
Non-rep Pk Forward Current-Max 300 A 300 A
Number of Elements 4 4
Number of Phases 1 1
Number of Terminals 4 4
Operating Temperature-Max 150 °C 125 °C
Operating Temperature-Min -55 °C
Output Current-Max 25 A 25 A
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape SQUARE SQUARE
Package Style FLANGE MOUNT FLANGE MOUNT
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Rep Pk Reverse Voltage-Max 600 V 100 V
Reverse Current-Max 5 µA
Reverse Test Voltage 600 V
Surface Mount NO NO
Terminal Form SOLDER LUG SOLDER LUG
Terminal Position UPPER UPPER
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 26 1
Package Description S-PUFM-D4
Case Connection ISOLATED
Reference Standard UL RECOGNIZED
Technology AVALANCHE

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