GAL26CV12-15LJB
vs
GAL26CV12C-10LJI
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
LATTICE SEMICONDUCTOR CORP
Part Package Code
QLCC
QLCC
Package Description
PLASTIC, LCC-28
PLASTIC, LCC-28
Pin Count
28
28
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Architecture
PAL-TYPE
PAL-TYPE
Clock Frequency-Max
50 MHz
71.4 MHz
JESD-30 Code
S-PQCC-J28
S-PQCC-J28
JESD-609 Code
e0
e0
Length
11.5316 mm
11.5062 mm
Moisture Sensitivity Level
1
1
Number of Dedicated Inputs
13
13
Number of I/O Lines
12
12
Number of Inputs
26
26
Number of Outputs
12
12
Number of Product Terms
122
122
Number of Terminals
28
28
Operating Temperature-Max
75 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
13 DEDICATED INPUTS, 12 I/O
13 DEDICATED INPUTS, 12 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Equivalence Code
LDCC28,.5SQ
LDCC28,.5SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Peak Reflow Temperature (Cel)
225
225
Programmable Logic Type
EE PLD
EE PLD
Propagation Delay
15 ns
10 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.57 mm
4.572 mm
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL EXTENDED
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn85Pb15)
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Width
11.5316 mm
11.5062 mm
Base Number Matches
1
1
ECCN Code
EAR99
Additional Feature
REGISTER PRELOAD; POWER-UP RESET
Compare GAL26CV12-15LJB with alternatives
Compare GAL26CV12C-10LJI with alternatives