GAL22V10D-20LD/883
vs
5962-8984108KX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
QP SEMICONDUCTOR INC
Part Package Code
DIP
DFP
Package Description
CERDIP-24
DFP,
Pin Count
24
24
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Architecture
PAL-TYPE
Clock Frequency-Max
31.2 MHz
50 MHz
JESD-30 Code
R-GDIP-T24
R-GDFP-F24
JESD-609 Code
e0
Length
31.75 mm
Moisture Sensitivity Level
1
Number of Dedicated Inputs
11
11
Number of I/O Lines
10
10
Number of Inputs
22
Number of Outputs
10
Number of Product Terms
132
Number of Terminals
24
24
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
11 DEDICATED INPUTS, 10 I/O
11 DEDICATED INPUTS, 10 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DFP
Package Equivalence Code
DIP24,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
FLATPACK
Programmable Logic Type
EE PLD
FLASH PLD
Propagation Delay
20 ns
15 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
5.08 mm
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4.5 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
FLAT
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
1
3
Compare GAL22V10D-20LD/883 with alternatives
Compare 5962-8984108KX with alternatives