G65SC12AC-4
vs
EF68A09JMB/C
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
CALIFORNIA MICRO DEVICES CORP
THOMSON-CSF SEMICONDUCTORS
Part Package Code
DIP
DIP
Package Description
DIP,
,
Pin Count
40
40
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
16
16
Bit Size
8
8
Boundary Scan
NO
NO
External Data Bus Width
8
8
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
R-CDIP-T40
R-GDIP-T40
Low Power Mode
NO
NO
Number of Terminals
40
40
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.72 mm
Speed
4 MHz
1.5 MHz
Supply Voltage-Max
5.25 V
5.25 V
Supply Voltage-Min
4.75 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
HMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
1
3
ECCN Code
3A001.A.2.C
Clock Frequency-Max
1.5 MHz
Screening Level
MIL-STD-883 Class B
Compare G65SC12AC-4 with alternatives
Compare EF68A09JMB/C with alternatives