EF68A09JMB/C
vs
MD80C88/B
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
THOMSON-CSF SEMICONDUCTORS
ROCHESTER ELECTRONICS LLC
Part Package Code
DIP
DIP
Package Description
,
CERDIP-40
Pin Count
40
40
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.31.00.01
Address Bus Width
16
20
Bit Size
8
16
Boundary Scan
NO
NO
Clock Frequency-Max
1.5 MHz
5 MHz
External Data Bus Width
8
8
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
R-GDIP-T40
R-CDIP-T40
Low Power Mode
NO
YES
Number of Terminals
40
40
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
COMMERCIAL
Screening Level
MIL-STD-883 Class B
Speed
1.5 MHz
5 MHz
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
HMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
3
4
Pbfree Code
Rohs Code
JESD-609 Code
e0
Moisture Sensitivity Level
NOT APPLICABLE
Peak Reflow Temperature (Cel)
NOT APPLICABLE
Seated Height-Max
5.72 mm
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Time@Peak Reflow Temperature-Max (s)
NOT APPLICABLE
Width
15.24 mm
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