G1213F
vs
LMV324MDC
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
| Ihs Manufacturer |
GLOBAL MIXED-MODE TECHNOLOGY INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
TSOP
|
DIE
|
| Package Description |
LSSOP, TSOP5/6,.11,37
|
DIE, DIE OR CHIP
|
| Pin Count |
5
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Common-mode Reject Ratio-Nom |
56 dB
|
65 dB
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Voltage-Max |
6000 µV
|
7000 µV
|
| JESD-30 Code |
R-PDSO-G5
|
X-XUUC-N
|
| Length |
2.9 mm
|
|
| Low-Bias |
YES
|
NO
|
| Low-Offset |
NO
|
NO
|
| Micropower |
NO
|
YES
|
| Number of Functions |
1
|
4
|
| Number of Terminals |
5
|
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-20 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
LSSOP
|
DIE
|
| Package Equivalence Code |
TSOP5/6,.11,37
|
DIE OR CHIP
|
| Package Shape |
RECTANGULAR
|
UNSPECIFIED
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
UNCASED CHIP
|
| Packing Method |
TAPE AND REEL
|
|
| Power |
NO
|
NO
|
| Programmable Power |
NO
|
NO
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.4 mm
|
|
| Slew Rate-Nom |
4 V/us
|
1 V/us
|
| Supply Current-Max |
1.2 mA
|
1.16 mA
|
| Supply Voltage Limit-Max |
7 V
|
5.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.95 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Unity Gain BW-Nom |
3000
|
1000
|
| Wideband |
NO
|
NO
|
| Width |
1.6 mm
|
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Average Bias Current-Max (IIB) |
|
0.25 µA
|
| Bias Current-Max (IIB) @25C |
|
0.25 µA
|
| Moisture Sensitivity Level |
|
1
|
| Neg Supply Voltage Limit-Max |
|
|
| Neg Supply Voltage-Nom (Vsup) |
|
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Technology |
|
BICMOS
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Voltage Gain-Min |
|
10000
|
|
|
|
Compare G1213F with alternatives
Compare LMV324MDC with alternatives