FT61024-55C6M vs EDI88130CS55CB feature comparison

FT61024-55C6M Force Technologies Ltd

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EDI88130CS55CB Microsemi Corporation

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Part Life Cycle Code Active Transferred
Ihs Manufacturer FORCE TECHNOLOGIES LTD MICROSEMI CORP
Part Package Code DIP DIP
Package Description DIP, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32
Pin Count 32 32
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
Additional Feature LG-MAX
JESD-30 Code R-CDIP-T32 R-CDIP-T32
Length 42.672 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 128KX8 128KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.588 mm
Supply Current-Max 0.125 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 10.16 mm
Base Number Matches 1 5
Rohs Code No
Peak Reflow Temperature (Cel) NOT SPECIFIED
Screening Level MIL-STD-883
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare FT61024-55C6M with alternatives

Compare EDI88130CS55CB with alternatives