EDI88130CS55CB
vs
EDI88130LPS55CM
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
WHITE MICROELECTRONICS
WHITE ELECTRONIC DESIGNS CORP
Package Description
0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32
0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32
Reach Compliance Code
unknown
unknown
Access Time-Max
55 ns
55 ns
JESD-30 Code
R-CDIP-T32
R-CDIP-T32
Memory Density
1048576 bit
1048576 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
128KX8
128KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
MIL-PRF-38535
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
5
4
Rohs Code
I/O Type
COMMON
Length
40.64 mm
Output Characteristics
3-STATE
Package Equivalence Code
DIP32,.6
Seated Height-Max
3.937 mm
Standby Current-Max
0.002 A
Standby Voltage-Min
2 V
Supply Current-Max
0.2 mA
Terminal Pitch
2.54 mm
Width
15.24 mm
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