FS1G-LT
vs
FS1G
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICRO COMMERCIAL COMPONENTS CORP
|
MICROSEMI CORP
|
Part Package Code |
DO-214AC
|
DO-214AC
|
Package Description |
SMAJ, 2 PIN
|
PLASTIC, HSMA, 2 PIN
|
Pin Count |
2
|
2
|
Reach Compliance Code |
unknown
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Application |
GENERAL PURPOSE
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
JEDEC-95 Code |
DO-214AC
|
DO-214AC
|
JESD-30 Code |
R-PDSO-C2
|
R-PDSO-C2
|
JESD-609 Code |
e0
|
e0
|
Non-rep Pk Forward Current-Max |
30 A
|
30 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
2
|
Output Current-Max |
1 A
|
1 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
LONG FORM
|
Peak Reflow Temperature (Cel) |
240
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Rep Pk Reverse Voltage-Max |
400 V
|
400 V
|
Reverse Recovery Time-Max |
0.15 µs
|
0.2 µs
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
Terminal Form |
C BEND
|
C BEND
|
Terminal Position |
DUAL
|
END
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Base Number Matches |
1
|
6
|
Pbfree Code |
|
No
|
Forward Voltage-Max (VF) |
|
1.3 V
|
Operating Temperature-Max |
|
150 °C
|
|
|
|
Compare FS1G-LT with alternatives
Compare FS1G with alternatives