FMH23N50ES
vs
SFF24N50Z
feature comparison
All Stats
Differences Only
Part Life Cycle Code
End Of Life
Active
Ihs Manufacturer
FUJI ELECTRIC CO LTD
SOLID STATE DEVICES INC
Part Package Code
TO-3P(Q
TO-254Z
Package Description
FLANGE MOUNT, R-PSFM-T3
FLANGE MOUNT, S-XSFM-P3
Pin Count
3
3
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
Additional Feature
LOW NOISE
Avalanche Energy Rating (Eas)
767.3 mJ
Configuration
SINGLE WITH BUILT-IN DIODE
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min
500 V
500 V
Drain Current-Max (ID)
23 A
24 A
Drain-source On Resistance-Max
0.245 Ω
0.25 Ω
FET Technology
METAL-OXIDE SEMICONDUCTOR
METAL-OXIDE SEMICONDUCTOR
JESD-30 Code
R-PSFM-T3
S-XSFM-P3
Number of Elements
1
1
Number of Terminals
3
3
Operating Mode
ENHANCEMENT MODE
ENHANCEMENT MODE
Operating Temperature-Max
150 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Shape
RECTANGULAR
SQUARE
Package Style
FLANGE MOUNT
FLANGE MOUNT
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Power Dissipation-Max (Abs)
315 W
Pulsed Drain Current-Max (IDM)
92 A
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
NO
Terminal Form
THROUGH-HOLE
PIN/PEG
Terminal Position
SINGLE
SINGLE
Transistor Application
SWITCHING
SWITCHING
Transistor Element Material
SILICON
SILICON
Base Number Matches
1
1
Compare FMH23N50ES with alternatives
Compare SFF24N50Z with alternatives