FMA3008-000
vs
MGFC5211
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
RF MICRO DEVICES INC
|
MITSUBISHI ELECTRIC CORP
|
| Package Description |
DIE OR CHIP
|
DIE OR CHIP
|
| Reach Compliance Code |
unknown
|
unknown
|
| Characteristic Impedance |
50 Ω
|
|
| Construction |
COMPONENT
|
COMPONENT
|
| Gain |
10 dB
|
13 dB
|
| Input Power-Max (CW) |
20 dBm
|
16 dBm
|
| JESD-609 Code |
e4
|
|
| Number of Functions |
1
|
|
| Operating Frequency-Max |
20000 MHz
|
23600 MHz
|
| Operating Frequency-Min |
2000 MHz
|
21200 MHz
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
-20 °C
|
| Package Equivalence Code |
DIE OR CHIP
|
DIE OR CHIP
|
| Power Supplies |
7 V
|
5 V
|
| RF/Microwave Device Type |
WIDE BAND LOW POWER
|
WIDE BAND MEDIUM POWER
|
| Supply Current-Max |
160 mA
|
|
| Technology |
GAAS
|
GAAS
|
| Terminal Finish |
GOLD
|
|
| Base Number Matches |
1
|
1
|
| VSWR-Max |
|
2.2
|
|
|
|
Compare FMA3008-000 with alternatives
Compare MGFC5211 with alternatives