FM810LS3X
vs
ASM706EPA
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
ROCHESTER ELECTRONICS INC
ALLIANCE SEMICONDUCTOR CORP
Part Package Code
SOT-23
DIP
Package Description
TSSOP,
PLASTIC, DIP-8
Pin Count
3
8
Reach Compliance Code
unknown
unknown
Adjustable Threshold
NO
NO
Analog IC - Other Type
POWER SUPPLY SUPPORT CIRCUIT
VOLTAGE SUPERVISOR/RESET IC
JESD-30 Code
R-PDSO-G3
R-PDIP-T8
JESD-609 Code
e3
e0
Length
2.9 mm
9.59 mm
Moisture Sensitivity Level
NOT SPECIFIED
Number of Channels
1
1
Number of Functions
1
1
Number of Terminals
3
8
Operating Temperature-Max
105 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
1.14 mm
5.33 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1 V
1.2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.95 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
1.3 mm
7.62 mm
Base Number Matches
2
3
ECCN Code
EAR99
HTS Code
8542.39.00.01
Additional Feature
BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:N;WWD:N
Package Equivalence Code
DIP8,.3
Qualification Status
Not Qualified
Supply Current-Max (Isup)
0.14 mA
Technology
CMOS
Threshold Voltage-Nom
+4.4V
Compare FM810LS3X with alternatives
Compare ASM706EPA with alternatives