FLL200IB-1
vs
FLL200IB-3
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
EUDYNA DEVICES INC
FUJITSU SEMICONDUCTOR AMERICA INC
Package Description
HERMETIC SEALED, METAL CERAMIC, CASE IB, 2 PIN
FLANGE MOUNT, R-CDFM-F2
Pin Count
2
3
Manufacturer Package Code
CASE IB
CASE IB
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
Additional Feature
HIGH RELIABILITY
HIGH RELIABILITY
Case Connection
SOURCE
SOURCE
Configuration
SINGLE
SINGLE
DS Breakdown Voltage-Min
15 V
15 V
Drain Current-Max (ID)
6 A
6 A
FET Technology
JUNCTION
JUNCTION
Highest Frequency Band
L BAND
L BAND
JESD-30 Code
R-CDFM-F2
R-CDFM-F2
Number of Elements
1
1
Number of Terminals
2
2
Operating Mode
DEPLETION MODE
DEPLETION MODE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLANGE MOUNT
FLANGE MOUNT
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Form
FLAT
FLAT
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Transistor Application
AMPLIFIER
AMPLIFIER
Transistor Element Material
GALLIUM ARSENIDE
GALLIUM ARSENIDE
Base Number Matches
1
1
Compare FLL200IB-1 with alternatives
Compare FLL200IB-3 with alternatives