FIN1532MX
vs
DS90LV027AMWC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
SOIC
Package Description
0.150 INCH, MS-012, SOIC-16
DIE, WAFER
Pin Count
16
Reach Compliance Code
unknown
unknown
Input Characteristics
DIFFERENTIAL
STANDARD
Interface IC Type
LINE RECEIVER
LINE DRIVER
Interface Standard
EIA-644; TIA-644
EIA-644; TIA-644
JESD-30 Code
R-PDSO-G16
X-XUUC-N
JESD-609 Code
e3
Length
9.9 mm
Moisture Sensitivity Level
1
Number of Functions
4
2
Number of Terminals
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
SOP
DIE
Package Shape
RECTANGULAR
UNSPECIFIED
Package Style
SMALL OUTLINE
UNCASED CHIP
Peak Reflow Temperature (Cel)
260
Qualification Status
COMMERCIAL
Not Qualified
Receive Delay-Max
3 ns
Receiver Number of Bits
4
Seated Height-Max
1.75 mm
Supply Voltage-Max
5.5 V
3.6 V
Supply Voltage-Min
4.5 V
3 V
Supply Voltage-Nom
5 V
3.3 V
Surface Mount
YES
YES
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
DUAL
UPPER
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
Base Number Matches
3
2
ECCN Code
EAR99
HTS Code
8542.39.00.01
Differential Output
YES
Driver Number of Bits
2
High Level Input Current-Max
0.00001 A
Out Swing-Min
0.25 V
Package Equivalence Code
WAFER
Technology
CMOS
Transmit Delay-Max
1.5 ns
Compare FIN1532MX with alternatives
Compare DS90LV027AMWC with alternatives