FIN1019MTCX
vs
DS90LV019MWC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
FAIRCHILD SEMICONDUCTOR CORP
NATIONAL SEMICONDUCTOR CORP
Part Package Code
TSSOP
Package Description
4.40 MM, MO-153, TSSOP-14
DIE, WAFER
Pin Count
14
Manufacturer Package Code
14 LD,TSSOP,JEDEC MO-153, 4.4MM WIDE
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Differential Output
YES
YES
Driver Number of Bits
1
1
High Level Input Current-Max
0.00002 A
0.00001 A
Input Characteristics
DIFFERENTIAL
DIFFERENTIAL
Interface IC Type
LINE TRANSCEIVER
LINE TRANSCEIVER
Interface Standard
EIA-644; TIA-644
GENERAL PURPOSE
JESD-30 Code
R-PDSO-G14
X-XUUC-N
JESD-609 Code
e4
Length
5 mm
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Out Swing-Min
0.25 V
0.25 V
Output Low Current-Max
0.008 A
0.002 A
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
TSSOP
DIE
Package Equivalence Code
TSSOP14,.25
WAFER
Package Shape
RECTANGULAR
UNSPECIFIED
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
UNCASED CHIP
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Receive Delay-Max
2.5 ns
9 ns
Receiver Number of Bits
1
1
Seated Height-Max
1.2 mm
Supply Current-Max
12.5 mA
48 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.65 mm
Terminal Position
DUAL
UPPER
Time@Peak Reflow Temperature-Max (s)
30
40
Transmit Delay-Max
1.5 ns
7 ns
Width
4.4 mm
Base Number Matches
2
1
Additional Feature
CAN ALSO OPERATE WITH A 5V SUPPLY
Technology
CMOS
Compare FIN1019MTCX with alternatives
Compare DS90LV019MWC with alternatives