FDC6330L
vs
FDC6330L_NL
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
FAIRCHILD SEMICONDUCTOR CORP
|
FAIRCHILD SEMICONDUCTOR CORP
|
Part Package Code |
SSOT
|
SOT-23
|
Package Description |
SOT-6
|
LSSOP, TSOP6,.11,37
|
Pin Count |
6
|
6
|
Manufacturer Package Code |
6LD, SUPERSOT6, JEDEC MO-193, 1.6MM WIDE
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.29.00.95
|
8542.39.00.01
|
Built-in Protections |
TRANSIENT
|
TRANSIENT
|
Driver Number of Bits |
1
|
1
|
Interface IC Type |
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
|
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
|
JESD-30 Code |
R-PDSO-G6
|
R-PDSO-G6
|
JESD-609 Code |
e3
|
e3
|
Length |
2.92 mm
|
2.92 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
6
|
6
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Current Flow Direction |
SOURCE
|
SOURCE
|
Output Current-Max |
2.3 A
|
2.3 A
|
Output Peak Current Limit-Nom |
1.6 A
|
2.5 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LSSOP
|
LSSOP
|
Package Equivalence Code |
TSOP6,.11,37
|
TSOP6,.11,37
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.22 mm
|
1.22 mm
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.95 mm
|
0.95 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
1.6 mm
|
1.6 mm
|
Base Number Matches |
3
|
1
|
|
|
|
Compare FDC6330L with alternatives
Compare FDC6330L_NL with alternatives