FA80386EXTB20
vs
MB86833PFV-G
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
FUJITSU SEMICONDUCTOR AMERICA INC
|
| Package Description |
LFQFP,
|
LFQFP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
26
|
28
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
NO
|
| Clock Frequency-Max |
40 MHz
|
33.33 MHz
|
| External Data Bus Width |
16
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
YES
|
| JESD-30 Code |
S-PQFP-G144
|
S-PQFP-G144
|
| Length |
20 mm
|
20 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of DMA Channels |
2
|
|
| Number of External Interrupts |
12
|
|
| Number of Serial I/Os |
3
|
|
| Number of Terminals |
144
|
144
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
118 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
LFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
|
| Seated Height-Max |
1.7 mm
|
1.7 mm
|
| Speed |
20 MHz
|
|
| Supply Current-Max |
110 mA
|
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
2.7 V
|
3 V
|
| Supply Voltage-Nom |
3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
20 mm
|
20 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
2
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
144
|
|
|
|
Compare FA80386EXTB20 with alternatives
Compare MB86833PFV-G with alternatives