F356635S vs 5962-8751512LX feature comparison

F356635S Fairchild Semiconductor Corporation

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5962-8751512LX Teledyne e2v

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer FAIRCHILD SEMICONDUCTOR CORP TELEDYNE E2V (UK) LTD
Part Package Code DIP DIP
Package Description DIP, CERAMIC, DIP-24
Pin Count 24 24
Reach Compliance Code unknown compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.71 8542.32.00.61
Access Time-Max 200 ns 25 ns
JESD-30 Code R-GDIP-T24 R-GDIP-T24
Length 32.0675 mm
Memory Density 4194304 bit 65536 bit
Memory IC Type MASK ROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Organization 512KX8 8KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 6.37 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology NMOS CMOS
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
Base Number Matches 1 3
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Screening Level MIL-STD-883
Supply Current-Max 0.14 mA
Temperature Grade MILITARY

Compare F356635S with alternatives

Compare 5962-8751512LX with alternatives