F356525S
vs
5962-8751503JA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
FAIRCHILD SEMICONDUCTOR CORP
STMICROELECTRONICS
Part Package Code
DIP
DIP
Package Description
DIP,
0.600 INCH, WINDOWED, CERDIP-24
Pin Count
24
24
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.71
8542.32.00.61
Access Time-Max
170 ns
70 ns
JESD-30 Code
R-GDIP-T24
R-GDIP-T24
Length
32.0675 mm
32.135 mm
Memory Density
134217728 bit
65536 bit
Memory IC Type
MASK ROM CARD
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Organization
16MX8
8KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
WDIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
6.37 mm
5.72 mm
Supply Voltage-Max (Vsup)
5.25 V
5.5 V
Supply Voltage-Min (Vsup)
4.75 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
NMOS
CMOS
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
1
5
Pbfree Code
No
Rohs Code
No
JESD-609 Code
e0
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Temperature Grade
MILITARY
Terminal Finish
TIN LEAD
Compare F356525S with alternatives
Compare 5962-8751503JA with alternatives