F356525S
vs
27HC641L-55/J
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FAIRCHILD SEMICONDUCTOR CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
DIP
DIP
Package Description
DIP,
WINDOWED, CERDIP-24
Pin Count
24
24
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.61
Access Time-Max
170 ns
55 ns
JESD-30 Code
R-GDIP-T24
R-GDIP-T24
Length
32.0675 mm
Memory Density
134217728 bit
65536 bit
Memory IC Type
MASK ROM CARD
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Organization
16MX8
8KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
WDIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
6.37 mm
Supply Voltage-Max (Vsup)
5.25 V
5.5 V
Supply Voltage-Min (Vsup)
4.75 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
NMOS
CMOS
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
I/O Type
COMMON
JESD-609 Code
e0
Operating Temperature-Max
70 °C
Operating Temperature-Min
Package Equivalence Code
DIP24,.6
Standby Current-Max
0.0001 A
Supply Current-Max
0.094 mA
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Compare F356525S with alternatives
Compare 27HC641L-55/J with alternatives