F356435P vs 27HC641-70/J feature comparison

F356435P Fairchild Semiconductor Corporation

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27HC641-70/J Microchip Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FAIRCHILD SEMICONDUCTOR CORP MICROCHIP TECHNOLOGY INC
Part Package Code DIP DIP
Package Description DIP, WINDOWED, CERDIP-24
Pin Count 24 24
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.61
Access Time-Max 200 ns 70 ns
JESD-30 Code R-PDIP-T24 R-GDIP-T24
Length 31.75 mm
Memory Density 2097152 bit 65536 bit
Memory IC Type MASK ROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Organization 256KX8 8KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP WDIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.698 mm
Supply Current-Max 0.04 mA 0.082 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology NMOS CMOS
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
I/O Type COMMON
JESD-609 Code e0
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Equivalence Code DIP24,.6
Standby Current-Max 0.04 A
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD

Compare F356435P with alternatives

Compare 27HC641-70/J with alternatives