F25L32PA-100PHG
vs
IS25LP032D-QBLE
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Contact Manufacturer
Active
Ihs Manufacturer
ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC
INTEGRATED SILICON SOLUTION INC
Part Package Code
SOIC
Package Description
0.300 INCH, ROHS COMPLIANT, SOIC-16
SOP,
Pin Count
16
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Clock Frequency-Max (fCLK)
100 MHz
133 MHz
JESD-30 Code
R-PDSO-G16
S-PDSO-G8
Length
10.3 mm
5.28 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
16
8
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
105 °C
Operating Temperature-Min
-40 °C
Organization
4MX8
4MX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
SERIAL
SERIAL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Seated Height-Max
2.65 mm
2.16 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.3 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Type
NOR TYPE
Width
7.5 mm
5.28 mm
Write Protection
HARDWARE/SOFTWARE
Base Number Matches
1
1
Rohs Code
Date Of Intro
2017-08-22
Alternate Memory Width
1
JESD-609 Code
e3
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Terminal Finish
Tin (Sn)
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare F25L32PA-100PHG with alternatives
Compare IS25LP032D-QBLE with alternatives