EZ80L92AZ020SC vs KDINTEL386CXSA33 feature comparison

EZ80L92AZ020SC IXYS Corporation

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KDINTEL386CXSA33 Intel Corporation

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred Active
Ihs Manufacturer IXYS CORP INTEL CORP
Part Package Code QFP QFP
Package Description PLASTIC, LQFP-100 BQFP,
Pin Count 100 100
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
Bit Size 8 32
JESD-30 Code S-PQFP-G100 S-PQFP-G100
JESD-609 Code e0
Length 14 mm 19.05 mm
Number of Terminals 100 100
Operating Temperature-Max 70 °C 58 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP BQFP
Package Equivalence Code QFP100,.63SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, BUMPER
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 4.57 mm
Speed 20 MHz 33 MHz
Supply Voltage-Max 3.6 V 5.5 V
Supply Voltage-Min 3 V 4.5 V
Supply Voltage-Nom 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.635 mm
Terminal Position QUAD QUAD
Width 14 mm 19.05 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 2 1
ECCN Code 3A991.A.2
Additional Feature BARREL SHIFTER; NUMERIC COPROCESSOR INTERFACE
Address Bus Width 26
Boundary Scan NO
Clock Frequency-Max 66 MHz
External Data Bus Width 16
Format FIXED POINT
Integrated Cache NO
Low Power Mode YES
Number of DMA Channels
Number of External Interrupts 3
Number of Serial I/Os
On Chip Data RAM Width
RAM (words) 0
Supply Current-Max 225 mA

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Compare KDINTEL386CXSA33 with alternatives