EXBA10P822J
vs
CND2B10TBK822J
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
PANASONIC CORP
KOA SPEER ELECTRONICS INC
Package Description
CHIP
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.20
Factory Lead Time
54 Weeks
Samacsys Manufacturer
Panasonic
Construction
Rectangular
Chip
Element Power Dissipation
0.063 W
First Element Resistance
8200 Ω
JESD-609 Code
e3
e3
Mounting Feature
SURFACE MOUNT
Network Type
BUSSED
BUSSED
Number of Elements
8
Number of Functions
1
Number of Terminals
10
10
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.55 mm
0.6 mm
Package Length
6.4 mm
6.4 mm
Package Shape
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
3.1 mm
3.1 mm
Packing Method
TR, EMBOSSED, 7 INCH
Bulk
Rated Temperature
70 °C
Reference Standard
IEC60115-9
Resistance
8200 Ω
8200 Ω
Resistor Type
ARRAY/NETWORK RESISTOR
ARRAY/NETWORK RESISTOR
Second/Last Element Resistance
8200 Ω
Size Code
2512
2512
Surface Mount
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
200 ppm/°C
200 ppm/°C
Terminal Finish
TIN OVER NICKEL
Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
Tolerance
5%
5%
Working Voltage
50 V
50 V
Base Number Matches
1
1
Rated Power Dissipation (P)
0.063 W
Compare EXBA10P822J with alternatives
Compare CND2B10TBK822J with alternatives