CND2B10TBK822J
vs
RACF648R8.2K5%R
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
KOA SPEER ELECTRONICS INC
STACKPOLE ELECTRONICS INC
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
Construction
Chip
Chip
JESD-609 Code
e3
e3
Network Type
BUSSED
BUSSED
Number of Terminals
10
10
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.6 mm
0.6 mm
Package Length
6.4 mm
6.4 mm
Package Style
SMT
SMT
Package Width
3.1 mm
3.1 mm
Packing Method
Bulk
TAPE, EMBOSSED
Rated Power Dissipation (P)
0.063 W
0.063 W
Resistance
8200 Ω
8200 Ω
Resistor Type
ARRAY/NETWORK RESISTOR
ARRAY/NETWORK RESISTOR
Size Code
2512
1225
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
200 ppm/°C
200 ppm/°C
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
Matte Tin (Sn) - with Nickel (Ni) barrier
Tolerance
5%
5%
Working Voltage
50 V
50 V
Base Number Matches
1
1
Pbfree Code
Package Description
CHIP, ROHS COMPLIANT
HTS Code
8533.21.00.20
Element Power Dissipation
0.063 W
First Element Resistance
8200 Ω
Manufacturer Series
RAC
Mounting Feature
SURFACE MOUNT
Number of Elements
8
Number of Functions
1
Package Shape
RECTANGULAR PACKAGE
Rated Temperature
70 °C
Series
RAC648R(5%)
Surface Mount
YES
Terminal Shape
WRAPAROUND
Compare CND2B10TBK822J with alternatives
Compare RACF648R8.2K5%R with alternatives