EXBA10P822J
vs
745C101822JP
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
PANASONIC CORP
CTS CORP
Package Description
CHIP
CHIP, ROHS COMPLIANT
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.20
8533.21.00.20
Factory Lead Time
54 Weeks
27 Weeks
Samacsys Manufacturer
Panasonic
Construction
Rectangular
Rectangular
Element Power Dissipation
0.063 W
0.063 W
First Element Resistance
8200 Ω
8200 Ω
JESD-609 Code
e3
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Network Type
BUSSED
BUSSED
Number of Elements
8
8
Number of Functions
1
1
Number of Terminals
10
10
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.55 mm
0.575 mm
Package Length
6.4 mm
3.1 mm
Package Shape
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
3.1 mm
6.4 mm
Packing Method
TR, EMBOSSED, 7 INCH
TR, PLASTIC, 7 INCH
Rated Temperature
70 °C
70 °C
Reference Standard
IEC60115-9
Resistance
8200 Ω
8200 Ω
Resistor Type
ARRAY/NETWORK RESISTOR
ARRAY/NETWORK RESISTOR
Second/Last Element Resistance
8200 Ω
8200 Ω
Size Code
2512
1225
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
200 ppm/°C
250 ppm/°C
Terminal Finish
TIN OVER NICKEL
Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
5%
5%
Working Voltage
50 V
50 V
Base Number Matches
1
1
Rated Power Dissipation (P)
0.504 W
Compare EXBA10P822J with alternatives
Compare 745C101822JP with alternatives