ERE75-005
vs
5R5/LC3
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
FUJI ELECTRIC CO LTD
|
SOLID STATE DEVICES INC
|
Package Description |
O-XUPM-D1
|
LCC-3
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Additional Feature |
LEAKAGE CURRENT IS NOT AT 25 DEG C
|
|
Application |
FAST RECOVERY POWER
|
ULTRA FAST RECOVERY
|
Case Connection |
CATHODE
|
CATHODE
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
0.95 V
|
|
JESD-30 Code |
O-XUPM-D1
|
R-CBCC-N3
|
Non-rep Pk Forward Current-Max |
350 A
|
350 A
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
1
|
3
|
Operating Temperature-Max |
150 °C
|
175 °C
|
Operating Temperature-Min |
-40 °C
|
-65 °C
|
Output Current-Max |
30 A
|
30 A
|
Package Body Material |
UNSPECIFIED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Shape |
ROUND
|
RECTANGULAR
|
Package Style |
POST/STUD MOUNT
|
CHIP CARRIER
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Rep Pk Reverse Voltage-Max |
50 V
|
50 V
|
Reverse Current-Max |
3000 µA
|
|
Reverse Recovery Time-Max |
0.3 µs
|
0.065 µs
|
Surface Mount |
NO
|
YES
|
Terminal Form |
SOLDER LUG
|
NO LEAD
|
Terminal Position |
UPPER
|
BOTTOM
|
Base Number Matches |
1
|
2
|
Part Package Code |
|
DLCC
|
Pin Count |
|
3
|
|
|
|