EPM7256BTC144
vs
EPM7256AEFC256-7
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ALTERA CORP
|
INTEL CORP
|
| Part Package Code |
QFP
|
|
| Package Description |
LFQFP,
|
FINE LINE, BGA-256
|
| Pin Count |
144
|
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PQFP-G144
|
S-PBGA-B256
|
| JESD-609 Code |
e3
|
e0
|
| Length |
20 mm
|
17 mm
|
| Number of Dedicated Inputs |
|
|
| Number of I/O Lines |
120
|
164
|
| Number of Terminals |
144
|
256
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
0 DEDICATED INPUTS, 120 I/O
|
0 DEDICATED INPUTS, 164 I/O
|
| Output Function |
MACROCELL
|
MACROCELL
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
GRID ARRAY
|
| Programmable Logic Type |
EE PLD
|
EE PLD
|
| Propagation Delay |
5 ns
|
7.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
2.1 mm
|
| Supply Voltage-Nom |
2.5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn63Pb37)
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.5 mm
|
1 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
20 mm
|
17 mm
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
No
|
| Samacsys Manufacturer |
|
Intel
|
| Additional Feature |
|
YES
|
| Clock Frequency-Max |
|
126.6 MHz
|
| In-System Programmable |
|
YES
|
| JTAG BST |
|
YES
|
| Moisture Sensitivity Level |
|
3
|
| Number of Macro Cells |
|
256
|
| Package Equivalence Code |
|
BGA256,16X16,40
|
| Peak Reflow Temperature (Cel) |
|
220
|
| Supply Voltage-Max |
|
3.6 V
|
| Supply Voltage-Min |
|
3 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare EPM7256BTC144 with alternatives
Compare EPM7256AEFC256-7 with alternatives