EPM2210F324I3N vs EPM2210F324C3 feature comparison

EPM2210F324I3N Intel Corporation

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EPM2210F324C3 Intel Corporation

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Rohs Code Yes No
Part Life Cycle Code Active Active
Ihs Manufacturer INTEL CORP INTEL CORP
Package Description 19 X 19 MM, 1 MM PITCH, LEAD FREE, FBGA-324 19 X 19 MM, 1 MM PITCH, FBGA-324
Reach Compliance Code compliant compliant
ECCN Code 3A991.D 3A991
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature IT CAN ALSO OPERATE AT 3.3V IT CAN ALSO OPERATE AT 3.3V
In-System Programmable YES YES
JESD-30 Code S-PBGA-B324 S-PBGA-B324
JESD-609 Code e1 e0
JTAG BST YES YES
Length 19 mm 19 mm
Number of Dedicated Inputs
Number of I/O Lines 272 272
Number of Inputs 272 272
Number of Macro Cells 1700 1700
Number of Outputs 272 272
Number of Terminals 324 324
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 0 DEDICATED INPUTS, 272 I/O 0 DEDICATED INPUTS, 272 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA324,18X18,40 BGA324,18X18,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FLASH PLD FLASH PLD
Propagation Delay 7 ns 7 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm 2.2 mm
Supply Voltage-Max 2.625 V 2.625 V
Supply Voltage-Min 2.375 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 19 mm 19 mm
Base Number Matches 2 2
Samacsys Manufacturer Intel
Moisture Sensitivity Level 3
Temperature Grade COMMERCIAL EXTENDED

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