EPM2210F324I3N
vs
EPM2210F324A3
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
INTEL CORP
|
ALTERA CORP
|
| Package Description |
19 X 19 MM, 1 MM PITCH, LEAD FREE, FBGA-324
|
BGA, BGA324,18X18,40
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.D
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
IT CAN ALSO OPERATE AT 3.3V
|
YES
|
| In-System Programmable |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B324
|
S-PBGA-B324
|
| JESD-609 Code |
e1
|
e0
|
| JTAG BST |
YES
|
YES
|
| Length |
19 mm
|
|
| Number of Dedicated Inputs |
|
|
| Number of I/O Lines |
272
|
|
| Number of Inputs |
272
|
|
| Number of Macro Cells |
1700
|
1700
|
| Number of Outputs |
272
|
|
| Number of Terminals |
324
|
324
|
| Operating Temperature-Max |
100 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
0 DEDICATED INPUTS, 272 I/O
|
|
| Output Function |
MACROCELL
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA324,18X18,40
|
BGA324,18X18,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Programmable Logic Type |
FLASH PLD
|
FLASH PLD
|
| Propagation Delay |
7 ns
|
7 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.2 mm
|
|
| Supply Voltage-Max |
2.625 V
|
|
| Supply Voltage-Min |
2.375 V
|
|
| Supply Voltage-Nom |
2.5 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
19 mm
|
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
No
|
| Moisture Sensitivity Level |
|
1
|
|
|
|
Compare EPM2210F324I3N with alternatives
Compare EPM2210F324A3 with alternatives