EPF8282VTC100-3
vs
EPF8282ALC84-4N
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ALTERA CORP
ALTERA CORP
Part Package Code
QFP
LCC
Package Description
LFQFP, TQFP100,.63SQ
PLASTIC, LCC-84
Pin Count
100
84
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
282 FLIP FLOPS; 208 LOGIC ELEMENTS; BUILT-IN JTAG BOUNDARY-SCAN TEST CIRCUITRY
208 LOGIC ELEMENTS
JESD-30 Code
S-PQFP-G100
S-PQCC-J84
JESD-609 Code
e0
e3
Length
14 mm
29.3116 mm
Moisture Sensitivity Level
3
3
Number of Dedicated Inputs
4
4
Number of I/O Lines
74
68
Number of Inputs
78
68
Number of Logic Cells
208
208
Number of Outputs
74
68
Number of Terminals
100
84
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
4 DEDICATED INPUTS, 74 I/O
4 DEDICATED INPUTS, 68 I/O
Output Function
REGISTERED
REGISTERED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
QCCJ
Package Equivalence Code
TQFP100,.63SQ
LDCC84,1.2SQ
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
CHIP CARRIER
Peak Reflow Temperature (Cel)
220
245
Programmable Logic Type
LOADABLE PLD
LOADABLE PLD
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.27 mm
5.08 mm
Supply Voltage-Max
3.6 V
5.25 V
Supply Voltage-Min
3 V
4.75 V
Supply Voltage-Nom
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
GULL WING
J BEND
Terminal Pitch
0.5 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
14 mm
29.3116 mm
Base Number Matches
1
2
Pbfree Code
Time@Peak Reflow Temperature-Max (s)
30
Compare EPF8282VTC100-3 with alternatives
Compare EPF8282ALC84-4N with alternatives